FEP Wire
Overview
FEP wire is insulated with Fluorinated Ethylene Propylene (FEP), a melt-processable fluoropolymer known for its excellent thermal, chemical, and electrical properties. It is widely used in chemical, medical, electronics, and aerospace applications where reliability under harsh conditions is essential. According to UL standards, UL 1332 is a typical FEP-insulated hook-up wire, rated for 200 °C and 300 V, while UL 1330 provides a 200 °C, 600 V option—both serving as industry benchmarks.
Properties
FEP offers a low dielectric constant, non-stick surface, and low friction, making it well-suited for compact assemblies and stable signal transmission. It is chemically inert to most solvents, oils, and acids, and provides good UV and weather resistance. Voltage ratings depend on the UL style, AWG size, and insulation thickness—for example, UL 1332 is 300 V, while UL 1330 supports 600 V. Many FEP wire types are also designed to meet the UL VW-1 vertical flame test, depending on construction and manufacturer.
Applications
Typical constructions use tinned copper or silver-plated copper stranded conductors, balancing conductivity with routing flexibility. Commercial FEP wire offerings, such as UL 1332, are available in a wide range of AWG sizes. Thanks to its heat resistance, chemical durability, and electrical stability, FEP wire is widely used in medical devices, aerospace and aviation systems, industrial automation, and semiconductor equipment, where long-term reliability and insulation integrity are critical.
UL10064
UL10064 FEP wire, UL-certified and rated 105°C/30V, ideal for compact electronics, sensors, and medical devices. Offers flexibility, chemical resistance, and reliable high-density wiring.
UL1332
UL1332 FEP hook-up wire, UL-certified and rated 200°C/300V. Thin-wall design offers thermal stability, chemical resistance, and reliable wiring for appliances, machinery, and electronics.
UL1330
UL1330 FEP hook-up wire, UL-certified and rated 200°C/600V. Provides thermal endurance, chemical resistance, and compact design for electronics, medical, control panels, and OEM systems.